Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786559 | Process and material for preventing deleterious expansion of high aspect ratio copper filled through silicon vias (TSVs) | Paul A. Zimmerman, Scott B. Clendenning, Paul B. Fischer, Robert Edgeworth | 2017-10-10 |
| 9583389 | Selective area deposition of metal films by atomic layer deposition (ALD) and chemical vapor deposition (CVD) | Scott B. Clendenning, Jeanette M. Roberts, Florian Gstrein | 2017-02-28 |