Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793163 | Subtractive self-aligned via and plug patterning for back end of line (BEOL) interconnects | Robert L. Bristol, Richard E. Schenker, Paul A. Nyhus, Charles H. Wallace, Hui Jae Yoo | 2017-10-17 |
| 9754778 | Metallization of fluorocarbon-based dielectric for interconnects | David J. Michalak | 2017-09-05 |
| 9659869 | Forming barrier walls, capping, or alloys /compounds within metal lines | Christopher J. Jezewski, Alan M Meyers, Kanwal Jit Singh, Tejaswi K. Indukuri, James S. Clarke | 2017-05-23 |
| 9583389 | Selective area deposition of metal films by atomic layer deposition (ALD) and chemical vapor deposition (CVD) | Patricio E. Romero, Scott B. Clendenning, Jeanette M. Roberts | 2017-02-28 |