Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721898 | Methods of forming under device interconnect structures | Patrick Morrow, Don Nelson, Kimin Jun, Il-Seok Son | 2017-08-01 |
| 9685436 | Monolithic three-dimensional (3D) ICs with local inter-level interconnects | Patrick Morrow, Kimin Jun, Donald W. Nelson | 2017-06-20 |