Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837341 | Tin-zinc microbump structures | Sri Chaitra Jyotsna Chavali, Amanda E. Schuckman | 2017-12-05 |
| 9791470 | Magnet placement for integrated sensor packages | Feras Eid, Sasha N. Oster, Sarah Haney | 2017-10-17 |
| 9607947 | Reliable microstrip routing for electronics components | Omkar G. Karhade, Nevin Altunyurt, Krishna Bharath | 2017-03-28 |