Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837341 | Tin-zinc microbump structures | Sri Chaitra Jyotsna Chavali, Kyu Oh Lee | 2017-12-05 |
| 9741606 | Desmear with metalized protective film | Zheng Zhou, Sri Ranga Sai Boyapati | 2017-08-22 |
| 9640485 | Bridge interconnection with layered interconnect structures | Yueli Liu, Qinglei Zhang, Rui Zhang | 2017-05-02 |