Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9800015 | Optical interconnect on bumpless build-up layer package | Feras Eid, Johanna M. Swan | 2017-10-24 |
| 9748177 | Embedded structures for package-on-package architecture | Vinodhkumar Raghunathan | 2017-08-29 |
| 9708178 | Integration of laminate MEMS in BBUL coreless package | Robert L. Sankman | 2017-07-18 |
| 9686870 | Method of forming a microelectronic device package | John S. Guzek | 2017-06-20 |
| 9674945 | Heterogeneous integration of microfluidic devices in package structures | Kevin Lin, Feras Eid, Qing Ma | 2017-06-06 |
| 9601421 | BBUL material integration in-plane with embedded die for warpage control | Deepak Kulkarni | 2017-03-21 |
| 9576909 | Bumpless die-package interface for bumpless build-up layer (BBUL) | John S. Guzek, Robert L. Sankman | 2017-02-21 |