Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9808875 | Methods of fabricating low melting point solder reinforced sealant and structures formed thereby | Carl Deppisch, Leonel Arana, Gregory S. Constable, Sriram Srinivasan | 2017-11-07 |
| 9679843 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravindranath V. Mahajan | 2017-06-13 |
| 9601421 | BBUL material integration in-plane with embedded die for warpage control | Weng Hong Teh | 2017-03-21 |