Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9808875 | Methods of fabricating low melting point solder reinforced sealant and structures formed thereby | Deepak Kulkarni, Leonel Arana, Gregory S. Constable, Sriram Srinivasan | 2017-11-07 |
| 9613933 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more | 2017-04-04 |