Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9613933 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Ashay Dani, Edward R. Prack +6 more | 2017-04-04 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9613933 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Ashay Dani, Edward R. Prack +6 more | 2017-04-04 |