Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9808875 | Methods of fabricating low melting point solder reinforced sealant and structures formed thereby | Deepak Kulkarni, Carl Deppisch, Leonel Arana, Sriram Srinivasan | 2017-11-07 |