Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9808875 | Methods of fabricating low melting point solder reinforced sealant and structures formed thereby | Deepak Kulkarni, Carl Deppisch, Gregory S. Constable, Sriram Srinivasan | 2017-11-07 | $13,901,000 |
| 9793233 | Forming sacrificial composite materials for package-on-package architectures and structures formed thereby | Rajasekaran Swaminathan, Yoshihiro Tomita, Yosuke Kanaoka | 2017-10-17 | $9,876,000 |
| 9659899 | Die warpage control for thin die assembly | Sandeep B. Sane, Shankar Ganapathysubramanian, Jorge Sanchez, Eric J. Li, Nitin A. Deshpande +2 more | 2017-05-23 | $7,972,000 |