Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659899 | Die warpage control for thin die assembly | Shankar Ganapathysubramanian, Jorge Sanchez, Leonel Arana, Eric J. Li, Nitin A. Deshpande +2 more | 2017-05-23 |
| 9659908 | Systems and methods for package on package through mold interconnects | Shubhada H. Sahasrabudhe, Siddarth Kumar, Shalabh Tandon | 2017-05-23 |