Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9735089 | Thermal management for flexible integrated circuit packages | Hemanth K. Dhavaleswarapu | 2017-08-15 |
| 9659908 | Systems and methods for package on package through mold interconnects | Shubhada H. Sahasrabudhe, Sandeep B. Sane, Shalabh Tandon | 2017-05-23 |