Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659908 | Systems and methods for package on package through mold interconnects | Sandeep B. Sane, Siddarth Kumar, Shalabh Tandon | 2017-05-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659908 | Systems and methods for package on package through mold interconnects | Sandeep B. Sane, Siddarth Kumar, Shalabh Tandon | 2017-05-23 |