Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659908 | Systems and methods for package on package through mold interconnects | Shubhada H. Sahasrabudhe, Sandeep B. Sane, Siddarth Kumar | 2017-05-23 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659908 | Systems and methods for package on package through mold interconnects | Shubhada H. Sahasrabudhe, Sandeep B. Sane, Siddarth Kumar | 2017-05-23 |