Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748199 | Thermal compression bonding process cooling manifold | Zhihua Li, Joseph B. Petrini, Steven B. Roach, Shankar Devasenathipathy, George Kostiew +1 more | 2017-08-29 |
| 9735089 | Thermal management for flexible integrated circuit packages | Siddarth Kumar | 2017-08-15 |
| 9548284 | Reduced expansion thermal compression bonding process bond head | Pramod Malatkar, James Neeb | 2017-01-17 |