Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9548284 | Reduced expansion thermal compression bonding process bond head | Pramod Malatkar, Hemanth K. Dhavaleswarapu | 2017-01-17 | $15,866,000 |
JN
James Neeb — 1 Patent in 2017
Overall (2017): #386,156 of 506,227Top 80%
1
Patents 2017