Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9831213 | Bumpless build-up layer package with pre-stacked microelectronic devices | — | 2017-11-28 | $12,678,000 |
| 9818719 | Bumpless build-up layer package design with an interposer | — | 2017-11-14 | $11,178,000 |
| 9793225 | Thermal expansion compensators for controlling microelectronic package warpage | Richard J. Harries | 2017-10-17 | $9,876,000 |
| 9661745 | Vacuum lamination of depth-sensing camera module PCB to stiffener using built-in vacuum channels | Kyle Yazzie | 2017-05-23 | $7,972,000 |
| 9627227 | Bumpless build-up layer package warpage reduction | Drew W. Delaney | 2017-04-18 | $8,310,000 |
| 9548284 | Reduced expansion thermal compression bonding process bond head | Hemanth K. Dhavaleswarapu, James Neeb | 2017-01-17 | $15,866,000 |