Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9748199 | Thermal compression bonding process cooling manifold | Hemanth K. Dhavaleswarapu, Zhihua Li, Joseph B. Petrini, Shankar Devasenathipathy, George Kostiew +1 more | 2017-08-29 | $8,286,000 |