Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847308 | Magnetic intermetallic compound interconnect | Ravindranath V. Mahajan | 2017-12-19 |
| 9832876 | CPU package substrates with removable memory mechanical interfaces | Mani N. Prakash, Thomas T. Holden, Jeffory L. Smalley, Ram Viswanath, Bassam N. Coury +11 more | 2017-11-28 |
| 9793233 | Forming sacrificial composite materials for package-on-package architectures and structures formed thereby | Leonel Arana, Yoshihiro Tomita, Yosuke Kanaoka | 2017-10-17 |
| 9674954 | Chip package connector assembly | Donald T. Tran, Brent Stone, Ram Viswanath | 2017-06-06 |
| 9615483 | Techniques and configurations associated with a package load assembly | Gaurav Chawla, Joshua D. Heppner, Vijaykumar Krithivasan, Michael Garcia, Kuang Liu | 2017-04-04 |
| 9603247 | Electronic package with narrow-factor via including finish layer | Sairam Agraharam, Amruthavalli Pallavi Alur, Ram Viswanath, Wei-Lun Kane Jen | 2017-03-21 |