Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9788416 | Multilayer substrate for semiconductor packaging | Padam Jain, Dilan Seneviratne, Chi-Mon Chen | 2017-10-10 |
| 9704735 | Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabrication | Manohar S. Konchady, Tao Wu, Mihir K. Roy, Yi Li | 2017-07-11 |
| 9603247 | Electronic package with narrow-factor via including finish layer | Rajasekaran Swaminathan, Sairam Agraharam, Amruthavalli Pallavi Alur, Ram Viswanath | 2017-03-21 |
| 9548264 | High density organic bridge device and method | Mihir K. Roy, Stefanie M. Lotz | 2017-01-17 |