Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704735 | Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabrication | Manohar S. Konchady, Tao Wu, Mihir K. Roy, Wei-Lun Kane Jen | 2017-07-11 |