Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9788416 | Multilayer substrate for semiconductor packaging | Wei-Lun Kane Jen, Padam Jain, Dilan Seneviratne | 2017-10-10 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9788416 | Multilayer substrate for semiconductor packaging | Wei-Lun Kane Jen, Padam Jain, Dilan Seneviratne | 2017-10-10 |