Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9832865 | Methods and devices for providing increased routing flexibility in multi-layer printed circuit boards | Jack Ajoian | 2017-11-28 |
| 9788416 | Multilayer substrate for semiconductor packaging | Wei-Lun Kane Jen, Dilan Seneviratne, Chi-Mon Chen | 2017-10-10 |