Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9832865 | Methods and devices for providing increased routing flexibility in multi-layer printed circuit boards | Padam Jain | 2017-11-28 |
| 9668340 | Methods and devices for preventing overhangs in a finishing layer of metal formed on electrical contact surfaces when fabricating multi-layer printed circuit boards | Lea-Teng Lee | 2017-05-30 |
| 9609752 | Interconnect structure configured to control solder flow and method of manufacturing of same | Daniel L. Blass | 2017-03-28 |