Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793233 | Forming sacrificial composite materials for package-on-package architectures and structures formed thereby | Rajasekaran Swaminathan, Leonel Arana, Yoshihiro Tomita | 2017-10-17 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793233 | Forming sacrificial composite materials for package-on-package architectures and structures formed thereby | Rajasekaran Swaminathan, Leonel Arana, Yoshihiro Tomita | 2017-10-17 |