Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9832860 | Panel level fabrication of package substrates with integrated stiffeners | John S. Guzek, Patrick Nardi, Keith Jones, Javier Soto Gonzalez | 2017-11-28 |
| 9679843 | Localized high density substrate routing | Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravindranath V. Mahajan | 2017-06-13 |
| 9642248 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Qing Ma, Johanna M. Swan, John S. Guzek, Robert L. Sankman, Aleksandar Aleksov | 2017-05-02 |