Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9832860 | Panel level fabrication of package substrates with integrated stiffeners | Robert Starkston, John S. Guzek, Keith Jones, Javier Soto Gonzalez | 2017-11-28 | $12,678,000 |