Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9832860 | Panel level fabrication of package substrates with integrated stiffeners | Robert Starkston, John S. Guzek, Patrick Nardi, Keith Jones | 2017-11-28 |
| 9780054 | Semiconductor package with embedded die and its methods of fabrication | John S. Guzek, Nicholas R. Watts, Ravi Kiran Nalla | 2017-10-03 |
| 9691727 | Pad-less interconnect for electrical coreless substrate | Charavana K. Gurumurthy, Robert M. Nickerson, Debendra Mallik | 2017-06-27 |