Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780054 | Semiconductor package with embedded die and its methods of fabrication | John S. Guzek, Javier Soto Gonzalez, Ravi Kiran Nalla | 2017-10-03 |
| 9607937 | Pin grid interposer | Tao Wu | 2017-03-28 |