Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691727 | Pad-less interconnect for electrical coreless substrate | Javier Soto Gonzalez, Charavana K. Gurumurthy, Debendra Mallik | 2017-06-27 |
| 9691728 | BBUL top side substrate layer enabling dual sided silicon interconnect and stacking flexibility | Min Tao, John S. Guzek | 2017-06-27 |
| 9666549 | Methods for solder for through-mold interconnect | Chia-Pin Chiu, Xiaorong Xiong, Linda Zhang, Charles A. Gealer | 2017-05-30 |
| 9613934 | Interconnect structures with polymer core | Sandeep Razdan, Edward R. Prack, Sairam Agraharam, Robert L. Sankman, Shan Zhong | 2017-04-04 |