Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9741692 | Methods to form high density through-mold interconnections | Omkar G. Karhade, Nitin A. Deshpande, Edvin Cetegen, Eric J. Li, Bassam M. Ziadeh | 2017-08-22 | $8,061,000 |
| 9721880 | Integrated circuit package structures | Jimin Yao, Sanka Ganesan, Shawna M. Liff, Yikang Deng | 2017-08-01 | $11,137,000 |
| 9711441 | Reduced PTH pad for enabling core routing and substrate layer count reduction | Mihir K. Roy | 2017-07-18 | $6,909,000 |
| 9691727 | Pad-less interconnect for electrical coreless substrate | Javier Soto Gonzalez, Charavana K. Gurumurthy, Robert M. Nickerson | 2017-06-27 | $7,334,000 |
| 9679843 | Localized high density substrate routing | Robert Starkston, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravindranath V. Mahajan | 2017-06-13 | $8,497,000 |
| 9570883 | Photonic package architecture | Edward A. Zarbock | 2017-02-14 | $9,787,000 |