Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741664 | High density substrate interconnect formed through inkjet printing | Kinya Ichikawa, Robert L. Sankman | 2017-08-22 |
| 9679843 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Deepak Kulkarni, Ravindranath V. Mahajan | 2017-06-13 |
| 9673131 | Integrated circuit package assemblies including a glass solder mask layer | Chuan Hu, Qing Ma | 2017-06-06 |
| 9666549 | Methods for solder for through-mold interconnect | Xiaorong Xiong, Linda Zhang, Robert M. Nickerson, Charles A. Gealer | 2017-05-30 |
| 9589866 | Bridge interconnect with air gap in package assembly | Zhiguo Qian, Mathew J. Manusharow | 2017-03-07 |