Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741664 | High density substrate interconnect formed through inkjet printing | Chia-Pin Chiu, Robert L. Sankman | 2017-08-22 |
| 9685388 | Picture frame stiffeners for microelectronic packages | Yoshihiro Tomita, Jiro Kubota, Omkar G. Karhade, Shawna M. Liff, Nitin A. Deshpande | 2017-06-20 |