| 9847234 |
Embedded semiconductive chips in reconstituted wafers, and systems containing same |
John S. Guzek |
2017-12-19 |
| 9820384 |
Flexible electronic assembly method |
Sasha N. Oster, Charles A. Gealer, Omkar G. Karhade, John S. Guzek, Ravi Mahajan +8 more |
2017-11-14 |
| 9807866 |
Shielding mold for electric and magnetic EMI mitigation |
Zhichao Zhang, Adel A. Elsherbini, Kemal Aygun |
2017-10-31 |
| 9741664 |
High density substrate interconnect formed through inkjet printing |
Chia-Pin Chiu, Kinya Ichikawa |
2017-08-22 |
| 9708178 |
Integration of laminate MEMS in BBUL coreless package |
Weng Hong Teh |
2017-07-18 |
| 9686861 |
Glass core substrate for integrated circuit devices and methods of making the same |
Qing Ma, Quan Tran, Johanna M. Swan, Valluri Rao |
2017-06-20 |
| 9646851 |
Embedded semiconductive chips in reconstituted wafers, and systems containing same |
John S. Guzek |
2017-05-09 |
| 9642248 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging |
Qing Ma, Johanna M. Swan, Robert Starkston, John S. Guzek, Aleksandar Aleksov |
2017-05-02 |
| 9613934 |
Interconnect structures with polymer core |
Sandeep Razdan, Edward R. Prack, Sairam Agraharam, Shan Zhong, Robert M. Nickerson |
2017-04-04 |
| 9576909 |
Bumpless die-package interface for bumpless build-up layer (BBUL) |
Weng Hong Teh, John S. Guzek |
2017-02-21 |
| 9543224 |
Hybrid exposure for semiconductor devices |
Thorsten Meyer, Gerald Ofner |
2017-01-10 |