Issued Patents 2017
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847234 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | John S. Guzek | 2017-12-19 |
| 9820384 | Flexible electronic assembly method | Sasha N. Oster, Charles A. Gealer, Omkar G. Karhade, John S. Guzek, Ravi Mahajan +8 more | 2017-11-14 |
| 9807866 | Shielding mold for electric and magnetic EMI mitigation | Zhichao Zhang, Adel A. Elsherbini, Kemal Aygun | 2017-10-31 |
| 9741664 | High density substrate interconnect formed through inkjet printing | Chia-Pin Chiu, Kinya Ichikawa | 2017-08-22 |
| 9708178 | Integration of laminate MEMS in BBUL coreless package | Weng Hong Teh | 2017-07-18 |
| 9686861 | Glass core substrate for integrated circuit devices and methods of making the same | Qing Ma, Quan Tran, Johanna M. Swan, Valluri Rao | 2017-06-20 |
| 9646851 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | John S. Guzek | 2017-05-09 |
| 9642248 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Qing Ma, Johanna M. Swan, Robert Starkston, John S. Guzek, Aleksandar Aleksov | 2017-05-02 |
| 9613934 | Interconnect structures with polymer core | Sandeep Razdan, Edward R. Prack, Sairam Agraharam, Shan Zhong, Robert M. Nickerson | 2017-04-04 |
| 9576909 | Bumpless die-package interface for bumpless build-up layer (BBUL) | Weng Hong Teh, John S. Guzek | 2017-02-21 |
| 9543224 | Hybrid exposure for semiconductor devices | Thorsten Meyer, Gerald Ofner | 2017-01-10 |