Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793201 | Glass clad microelectronic substrate | Johanna M. Swan | 2017-10-17 |
| 9761514 | Substrate for integrated circuit devices including multi-layer glass core and methods of making the same | Chuan Hu, Patrick Morrow | 2017-09-12 |
| 9691579 | Package MEMS switch and method | Johanna M. Swan, Valluri Rao, Feras Eid | 2017-06-27 |
| 9686861 | Glass core substrate for integrated circuit devices and methods of making the same | Quan Tran, Robert L. Sankman, Johanna M. Swan, Valluri Rao | 2017-06-20 |
| 9674945 | Heterogeneous integration of microfluidic devices in package structures | Weng Hong Teh, Kevin Lin, Feras Eid | 2017-06-06 |
| 9673131 | Integrated circuit package assemblies including a glass solder mask layer | Chuan Hu, Chia-Pin Chiu | 2017-06-06 |
| 9642248 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Johanna M. Swan, Robert Starkston, John S. Guzek, Robert L. Sankman, Aleksandar Aleksov | 2017-05-02 |
| 9617148 | Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips | Johanna M. Swan, Min Tao, Charles A. Gealer, Edward Zarbock | 2017-04-11 |