Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9848490 | Solder in cavity interconnection technology | — | 2017-12-19 |
| 9761514 | Substrate for integrated circuit devices including multi-layer glass core and methods of making the same | Qing Ma, Patrick Morrow | 2017-09-12 |
| 9741645 | Dense interconnect with solder cap (DISC) formation with laser ablation and resulting semiconductor structures and packages | — | 2017-08-22 |
| 9685390 | Microelectronic package having non-coplanar, encapsulated microelectronic devices and a bumpless build-up layer | — | 2017-06-20 |
| 9673131 | Integrated circuit package assemblies including a glass solder mask layer | Qing Ma, Chia-Pin Chiu | 2017-06-06 |
| 9659885 | Semiconductor device with pre-molding chip bonding | — | 2017-05-23 |
| 9543197 | Package with dielectric or anisotropic conductive (ACF) buildup layer | Dingying Xu, Yoshihiro Tomita | 2017-01-10 |