Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806011 | Non-uniform substrate stackup | Zhichao Zhang, Tao Wu, Kemal Aygun | 2017-10-31 |
| 9622339 | Routing design for high speed input/output links | Kemal Aygun | 2017-04-11 |
| 9589866 | Bridge interconnect with air gap in package assembly | Chia-Pin Chiu, Mathew J. Manusharow | 2017-03-07 |
| 9548734 | Smart impedance matching for high-speed I/O | Hongjiang Song, Yan Song, Zhichao Zhang | 2017-01-17 |
| 9542522 | Interconnect routing configurations and associated techniques | Kemal Aygun, Dae-Woo Kim | 2017-01-10 |