Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741692 | Methods to form high density through-mold interconnections | Omkar G. Karhade, Nitin A. Deshpande, Eric J. Li, Debendra Mallik, Bassam M. Ziadeh | 2017-08-22 |
EC
Edvin Cetegen — 1 Patent in 2017
Overall (2017): #434,420 of 506,227Top 90%
1
Patents 2017