Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741692 | Methods to form high density through-mold interconnections | Omkar G. Karhade, Nitin A. Deshpande, Eric J. Li, Debendra Mallik, Bassam M. Ziadeh | 2017-08-22 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741692 | Methods to form high density through-mold interconnections | Omkar G. Karhade, Nitin A. Deshpande, Eric J. Li, Debendra Mallik, Bassam M. Ziadeh | 2017-08-22 |