Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721880 | Integrated circuit package structures | Jimin Yao, Sanka Ganesan, Shawna M. Liff, Debendra Mallik | 2017-08-01 |
| 9653419 | Microelectronic substrate having embedded trace layers with integral attachment structures | — | 2017-05-16 |