Issued Patents 2017
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9853359 | Antenna integrated in a package substrate | Adel A. Elsherbini | 2017-12-26 |
| 9820384 | Flexible electronic assembly method | Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, John S. Guzek +8 more | 2017-11-14 |
| 9786581 | Through-silicon via (TSV)-based devices and associated techniques and configurations | — | 2017-10-10 |
| 9773742 | Embedded millimeter-wave phased array module | Adel A. Elsherbini, Valluri Rao | 2017-09-26 |
| 9673268 | Integrated inductor for integrated circuit devices | Andreas Duevel, Valluri Rao, Uwe Zillmann | 2017-06-06 |
| 9659904 | Distributed on-package millimeter-wave radio | Adel A. Elsherbini | 2017-05-23 |
| 9653805 | Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates | Valluri Rao, Georgios Palaskas | 2017-05-16 |
| 9647636 | Piezoelectric package-integrated delay lines for radio frequency identification tags | Adel A. Elsherbini, Feras Eid, Vijay K. Nair, Georgios Dogiamis, Johanna M. Swan +1 more | 2017-05-09 |
| 9620847 | Integration of millimeter wave antennas on microelectronic substrates | — | 2017-04-11 |
| 9543244 | Hybrid package transmission line circuits | Chung Peng Jackson Kong, Chang-Tsung Fu, Chan Kim Lee, Ping Ping Ooi | 2017-01-10 |