| 9853359 |
Antenna integrated in a package substrate |
Adel A. Elsherbini |
2017-12-26 |
| 9820384 |
Flexible electronic assembly method |
Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, John S. Guzek +8 more |
2017-11-14 |
| 9786581 |
Through-silicon via (TSV)-based devices and associated techniques and configurations |
— |
2017-10-10 |
| 9773742 |
Embedded millimeter-wave phased array module |
Adel A. Elsherbini, Valluri Rao |
2017-09-26 |
| 9673268 |
Integrated inductor for integrated circuit devices |
Andreas Duevel, Valluri Rao, Uwe Zillmann |
2017-06-06 |
| 9659904 |
Distributed on-package millimeter-wave radio |
Adel A. Elsherbini |
2017-05-23 |
| 9653805 |
Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates |
Valluri Rao, Georgios Palaskas |
2017-05-16 |
| 9647636 |
Piezoelectric package-integrated delay lines for radio frequency identification tags |
Adel A. Elsherbini, Feras Eid, Vijay K. Nair, Georgios Dogiamis, Johanna M. Swan +1 more |
2017-05-09 |
| 9620847 |
Integration of millimeter wave antennas on microelectronic substrates |
— |
2017-04-11 |
| 9543244 |
Hybrid package transmission line circuits |
Chung Peng Jackson Kong, Chang-Tsung Fu, Chan Kim Lee, Ping Ping Ooi |
2017-01-10 |