Telesphor Kamgaing — 10 Patents at Intel

Issued Patents 2017

Showing 1–10 of 10 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9853359	Antenna integrated in a package substrate	Adel A. Elsherbini	2017-12-26	$14,594,000
9820384	Flexible electronic assembly method	Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, John S. Guzek +8 more	2017-11-14	$11,178,000
9786581	Through-silicon via (TSV)-based devices and associated techniques and configurations	—	2017-10-10	$9,084,000
9773742	Embedded millimeter-wave phased array module	Adel A. Elsherbini, Valluri Rao	2017-09-26	$12,582,000
9673268	Integrated inductor for integrated circuit devices	Andreas Duevel, Valluri Rao, Uwe Zillmann	2017-06-06	$12,588,000
9659904	Distributed on-package millimeter-wave radio	Adel A. Elsherbini	2017-05-23	$7,972,000
9653805	Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates	Valluri Rao, Georgios Palaskas	2017-05-16	$8,597,000
9647636	Piezoelectric package-integrated delay lines for radio frequency identification tags	Adel A. Elsherbini, Feras Eid, Vijay K. Nair, Georgios Dogiamis, Johanna M. Swan +1 more	2017-05-09	$10,144,000
9620847	Integration of millimeter wave antennas on microelectronic substrates	—	2017-04-11	$8,965,000
9543244	Hybrid package transmission line circuits	Chung Peng Jackson Kong, Chang-Tsung Fu, Chan Kim Lee, Ping Ping Ooi	2017-01-10	$11,357,000