{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Antenna integrated in a package substrate", "item": "https://www.patentleaderboard.com/patent/9853359"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Antenna integrated in a package substrate

Antenna integrated in a package substrate

US Patent 9853359 · Granted Dec 26, 2017

Estimated economic value: $14,594,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible die to floor planning with bump pitch scale through glass core via pitc2025
Microelectronic assemblies with communication networks2025
Packaging architecture with intermediate routing layers2025
Apparatus and method of manufacturing a vertically disaggregated photonic device2025
Cooling of conformal power delivery structures2025
Contactless communication using a waveguide extending through a substrate core2025
Inductor and transformer semiconductor devices using hybrid bonding technology2025
Fine-grained disaggregated server architecture2025
Packaging architectures for sub-terahertz radio frequency devices2025
Device, method and system to mitigate stress on hybrid bonds in a multi-tier arr2025
Physical vapor deposition seeding for high aspect ratio vias in glass core techn2025
High throughput additive manufacturing for integrated circuit components contain2025