WL

William J. Lambert

IN Intel: 3 patents #813 of 5,604Top 15%
Overall (2017): #54,740 of 506,227Top 15%
3
Patents 2017

Issued Patents 2017

Patent #TitleCo-InventorsDate
9842832 High density interconnection of microelectronic devices Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more 2017-12-12
9753510 Apparatus and method to reduce power losses in an integrated voltage regulator Krishna Bharath, Srikrishnan Venkataraman, Michael J. Hill, Alexander Slepoy, Dong Zhong +3 more 2017-09-05
9633938 Hybrid pitch package with ultra high density interconnect capability Mathew J. Manusharow, Daniel N. Sobieski, Mihir K. Roy 2017-04-25