Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9758845 | Microelectronic substrates having copper alloy conductive route structures | Robert Alan May, Sri Ranga Sai Boyapati, Amruthavalli Pallavi Alur | 2017-09-12 |
| 9633938 | Hybrid pitch package with ultra high density interconnect capability | Mathew J. Manusharow, Mihir K. Roy, William J. Lambert | 2017-04-25 |