Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831206 | LPS solder paste based low cost fine pitch pop interconnect solutions | James C. Matayabas, Jr., Akshay Mathkar | 2017-11-28 |
| 9795038 | Electronic package design that facilitates shipping the electronic package | Omkar G. Karhade, Nitin A. Deshpande | 2017-10-17 |
| 9669425 | Thermally and electrically conductive structure, method of applying a carbon coating to same, and method of reducing a contact resistance of same | Linda A. Shekhawat | 2017-06-06 |
| 9607964 | Method and materials for warpage thermal and interconnect solutions | Omkar G. Karhade, Nitin A. Deshpande, Aditya Sundoctor VAIDYA, Eric J. Li | 2017-03-28 |