Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831206 | LPS solder paste based low cost fine pitch pop interconnect solutions | Nachiket R. Raravikar, Akshay Mathkar | 2017-11-28 |
| 9640415 | Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials | Randall D. Lowe, Jr., Suriyakala Ramalingam, Nisha Ananthakrishnan, Arjun Krishnan, Hitesh Arora | 2017-05-02 |
| 9631065 | Methods of forming wafer level underfill materials and structures formed thereby | Anna M. Prakash, Arjun Krishnan, Nisha Ananthakrishnan | 2017-04-25 |