Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704767 | Mold compound with reinforced fibers | Yiqun Bai, Nisha Ananthakrishnan, Arjun Krishnan | 2017-07-11 |
| 9691675 | Method for forming an electrical device and electrical devices | Robert F. Cheney, Ashish Dhall | 2017-06-27 |
| 9640415 | Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials | Randall D. Lowe, Jr., Nisha Ananthakrishnan, James C. Matayabas, Jr., Arjun Krishnan, Hitesh Arora | 2017-05-02 |