Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704767 | Mold compound with reinforced fibers | Suriyakala Ramalingam, Yiqun Bai, Arjun Krishnan | 2017-07-11 |
| 9640415 | Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials | Randall D. Lowe, Jr., Suriyakala Ramalingam, James C. Matayabas, Jr., Arjun Krishnan, Hitesh Arora | 2017-05-02 |
| 9631065 | Methods of forming wafer level underfill materials and structures formed thereby | Anna M. Prakash, James C. Matayabas, Jr., Arjun Krishnan | 2017-04-25 |
| 9611372 | Narrow-gap flip chip underfill composition | Yonghao Xiu, Yiqun Bai, Arjun Krishnan | 2017-04-04 |