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Stiffener tape for electronic assembly |
Xavier Francois Brun, Mohit Mamodia, Dingying Xu |
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Mold compound with reinforced fibers |
Suriyakala Ramalingam, Yiqun Bai, Nisha Ananthakrishnan |
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| 9640415 |
Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials |
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2017-05-02 |
| 9631065 |
Methods of forming wafer level underfill materials and structures formed thereby |
Anna M. Prakash, James C. Matayabas, Jr., Nisha Ananthakrishnan |
2017-04-25 |
| 9620404 |
Stiffener tape for electronic assembly that includes wafer or panel |
Xavier Francois Brun |
2017-04-11 |
| 9611372 |
Narrow-gap flip chip underfill composition |
Yonghao Xiu, Nisha Ananthakrishnan, Yiqun Bai |
2017-04-04 |