Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9793151 | Stiffener tape for electronic assembly | Xavier Francois Brun, Mohit Mamodia, Dingying Xu | 2017-10-17 | $9,876,000 |
| 9704767 | Mold compound with reinforced fibers | Suriyakala Ramalingam, Yiqun Bai, Nisha Ananthakrishnan | 2017-07-11 | $8,311,000 |
| 9640415 | Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials | Randall D. Lowe, Jr., Suriyakala Ramalingam, Nisha Ananthakrishnan, James C. Matayabas, Jr., Hitesh Arora | 2017-05-02 | $12,076,000 |
| 9631065 | Methods of forming wafer level underfill materials and structures formed thereby | Anna M. Prakash, James C. Matayabas, Jr., Nisha Ananthakrishnan | 2017-04-25 | $8,972,000 |
| 9620404 | Stiffener tape for electronic assembly that includes wafer or panel | Xavier Francois Brun | 2017-04-11 | $8,965,000 |
| 9611372 | Narrow-gap flip chip underfill composition | Yonghao Xiu, Nisha Ananthakrishnan, Yiqun Bai | 2017-04-04 | $8,141,000 |