Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9827756 | Separation apparatus, separation system, and separation method | Osamu Hirakawa, Masaru Honda, Charles Singleton | 2017-11-28 |
| 9793151 | Stiffener tape for electronic assembly | Arjun Krishnan, Mohit Mamodia, Dingying Xu | 2017-10-17 |
| 9698108 | Structures to mitigate contamination on a back side of a semiconductor substrate | Shweta Agrawal, Hao Wu, Mohit Mamodia, Shengquan Ou, Hualiang Shi | 2017-07-04 |
| 9679798 | Substrate conveyance apparatus and substrate peeling system | Yasuharu Iwashita, Osamu Hirakawa, Yasutaka SOMA, Takeshi Tamura, Kazutaka Noda +1 more | 2017-06-13 |
| 9659889 | Solder-on-die using water-soluble resist system and method | Mihir A. Oka, Dingying Xu, Edward R. Prack, Kabirkumar Mirpuri, Saikumar Jayaraman | 2017-05-23 |
| 9620404 | Stiffener tape for electronic assembly that includes wafer or panel | Arjun Krishnan | 2017-04-11 |